Angstrom Engineering® has developed a series of platforms that provide quantum computing hardware pioneers a means to reliably and confidently create superconducting circuits, and their supporting hardware, in a highly repeatable and automated framework. 
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Process Specific 

Process Specific

Quantum Series

Perovskite Series

Reticle Ion Beam Sputter

Linear Sputter

2D Coatings

Space/Environmental Simulation

Glove Box Integration

Next Generation

Josephson Junctions
Super Conducting Sputtering,
Indium Bumps

The Quantum Series® of physical vapor deposition platforms cover a variety of fabrication processes vital in quantum computing research and commercial development.

A Quantum Series® system can focus on one fabrication process or include several in situ. We regularly manufacture and deliver Quantum Series® systems specific to aluminum-based Josephson junctions, sputtering superconducting materials like niobium, as well as systems dedicated to fabricating indium bump bonds.

alt = Quantum Series system by Angstrom Engineering. The machine is used for qubit fabrication through PVD (Physical Vapor Deposition) of superconducting materials. The setup includes a variety of mechanical and electronic components, with a control panel featuring a computer monitor on the right side with Angstrom’s software called Aeres.
alt = A Quantum Series machine branded by Angstrom Engineering, created for qubit fabrication using PVD (Physical Vapor Deposition) of superconducting materials. The machine includes thoroughly made mechanical components, as well as a computer monitor displaying operational data, positioned on the left side of the system using Aeres software.
alt = Angstrom Engineering's Quantum Series system, designed for a variety of fabrication processes and critical processes in quantum computing, including being used in Josephson junctions and establishing qubit benchmarks.
alt = Angstrom Engineering's Indium Quantum Series Bump Bond PVD Deposition System, a system designed for deposition of indium bumps, essential for advanced semiconductor fabrication. This system ensures precise control over bump height, shape, and placement.

Process Specific Advantages

Overview

The Quantum Series® of physical vapor deposition platforms cover a variety of fabrication processes vital in quantum computing research and commercial development. A Quantum Series® system can focus on one fabrication process or include several in-situ. We regularly manufacture and deliver Quantum Series® systems specific to aluminum-based Josephson junctions, sputtering superconducting materials like niobium, as well as systems dedicated to fabricating indium bump bonds.

Grow Uniform Tunnel Junctions
  • The Quantum Series® Josephson junction fabrication platform employs a number of features to ensure repeatable growth of pure, uniform oxide layers.
  • We can accommodate static oxidation, dynamic oxidation, as well as plasma and UV/ozone oxidation.
  • We employ a robust gas purification system, real-time oxide growth monitoring, and direct optical wafer temperature monitoring allowing oxides that are customizable, repeatable, and reliable.   
Precise Shadow Evaporation
  • Angstrom has refined our design to create an extremely repeatable, versatile, and robust fixture.
  • Process enhancements are available, including substrate heating, cooling, and biasing.

3D Transmon Qubit

The Josephson junctions our partners have fabricated measure up to established qubit benchmarks. These qubits were fabricated using Quantum Series® equipment and were independently characterized by the Institute for Quantum Computing (IQC) at the University of Waterloo, Ontario Canada.

Advanced Process Control Software

  • PC/PLC-controlled recipes for single, batch, or automated processes.
  • Advanced data logging and process tracking ensure consistent and repeatable processes.
  • High-resolution control provides impressive low-rate stability and consistent doping ratios.
  • The central control station manages each module and schedules the processes in each chamber.
  • Independent control of multiple chambers (if applicable).
  • Complex recipes can be created and modified easily.
  • Automatic PID control loop tuning significantly reduces process development time.
alt = A screenshot of Angstrom Engineering's AERES software on a monitor. The software is showing a detailed dashboard with charts, graphs, and data for monitoring and controlling thin film deposition processes. The layout has side navigation with equipment status icons and a central graph with real-time data. The interface is designed for precise control and analysis in advanced engineering applications for Angstrom Engineering’s systems.

Learn more about Aeres®.

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Dr. Steven Jim
University of California Irvine

Variable angle stages allow for very powerful thin film techniques. However, one of its biggest challenges is reproducibility. The substrate is often set at a very oblique angle in relation to the source, and the films are very sensitive to the precision of this angle. If it’s off by even half a degree, it will affect the morphology of these nanostructures considerably.

Angstrom went to great lengths to refine the tolerances of the tilt angle, improving it from a variation of up to a full degree on non-Angstrom systems I’ve used to less than 0.1 degree. Those wonderfully narrow tolerances allow us to repeatedly create very precise nanostructures. I can say wholeheartedly the product and service Angstrom Engineering® delivered has been amazing.