Magnetron Sputtering

Magnetron Sputtering

Overview

Radio Frequency (RF)

Direct Current (DC)

Pulsed Direct Current (DC)

Reactive Gas Sputtering

HiPIMS

Linear Magnetron Sputtering

Facing Target / Low-Damage

DC SPUTTERING

Direct Current Sputtering

Magnetron sputtering using DC power is an effective and economical choice for depositing conductive materials such as metals or transparent conductive oxides (TCOs). For magnetic materials such as Fe (iron), Ni (nickel), or Co (cobalt), DC magnetrons can be configured with magnets specifically selected for generating plasma within a strong magnetic field.

Deposition of non-conductive materials, however, requires a different power delivery system. Radio frequency (RF) power can be used for sputter deposition of insulating target materials, and pulsed DC power can be used for reactive sputter deposition of insulating materials from a conductive metal target.

alt = A close-up of a DC sputtering process, showing a glowing blue circular plasma inside a metallic chamber. The intense blue light highlights the advanced physical vapor deposition technique used for coating materials.

Go with Angstrom!  It’s an easy choice.  They have quality equipment, they have good people, and they have really great follow-through; they won’t sell you a system and then forget about you.  It’s a solid, good product and a great company to work with.

Dr.Trisha Andrew
University of Massachusetts Amherst