Low Pressure Chemical Vapor Deposition System

Designed and manufactured to meet the high temperature and rapid cooling requirements of graphene and CNT research, Angstrom’s LPCVD (Low Pressure Chemical Vapor Deposition) system will fit in nicely in your lab.

Low pressure chemical vapor deposition LPCVD system

We engineered a water-cooled furnace that can reach 1100°C in 10 minutes, as well as cool down below 800°C in a mere 2 minutes. Controlled graphene growth is ensured, and processing times are kept to a minimum with the Low Pressure Chemical Vapor Deposition system. Various chamber tube sizes are available between Ø 2 in and Ø 8 in allowing processing of single small samples up to batches in 6-inch wafers.

The tool you need to study and utilize Graphene and Carbon Nanotubes

A physicist working within an lpcvd system at university of Michigan

  • Reactor

  • Ø 50 mm-Ø 200 mm quartz tube chamber
  • Interchangeable Quartz tubes of various sizes as required
  • Accommodates Individual or multiple substrates up to 150 mm x 150 mm
  • Upstream end flange with quick connections to gas manifold
  • Downstream end flange with quick connections to pumping and gauging
LPCVD reactor chemical vapor deposition
LPCVD chemical vapor deposition reactor door
  • Temperature/Pressure Control

  • The Low Pressure Chemical Vapor Deposition system features a single zone quartz lamp furnace with 6-inch uniform temperature zone
  • Auto-tuning feature provides very stable temperature control
  • Rapid heating to 1100°C in 10 minutes
  • Rapid cooling from 1100°C to 800°C in 2 minutes
  • Downstream pressure control 100mTorr to 500Torr using a throttling VAT butterfly valve
  • Up to 12 mass flow controllers
  • Operation and Safety

  • Safety circuit (hardware and software)
  • Flammable gas sensor (H2)
  • Enclosed frame and safety guarding
  • PC / PLC controller including Windows based recipe and control software
  • Editable recipes, data logging, and password-protected access control
Gauges in the LPCVD Chemical Vapor deposition system

  • Aeres® Advanced Process Control Software

Screenshot of Aeres, a software platform that supports Angstrom Engineering's Physical vapor deposition systems
  • Simple to use yet highly sophisticated
  • PC/PLC controlled recipes for single, batch, or automated processes
  • Advanced data logging and process tracking ensure consistent and repeatable processes
  • High resolution control provides impressive low rate stability and consistent doping ratios
  • Central control station manages each module and schedules the processes in each chamber of the Low Pressure Chemical Vapor Deposition system
  • Independent control of multiple chambers (when applicable in cluster or connected configurations)
  • Complex recipes can be created and modified easily
  • Automatic PID control loop tuning significantly reduces process development time

From the time it was delivered, this laboratory system has performed nearly flawlessly, arguably extending our capabilities well beyond those currently attainable by any organic thin film laboratory in the world. I attribute the success of this entire system to the excellence of the engineering as well as the cooperative nature of the Angstrom team in taking our best designs and making them better during the system construction process.

Dr. Stephen Forrest – University of Michigan

Dr. Stephen Forrest from the University of Michigan

Please get in touch and we can collaborate on your project

When we work together, amazing things can happen. Your brilliant ideas with our innovative team will create the tool that will bring your research or production to the next level. We’re looking forward to hearing from you: