Indium Deposition for Superconducting Interconnects
Indium Bump Bonding
This high purity, readily available, and ductile material is ideal to integrate Josephson junctions with Al/AlOx/Al architecture onto silicon. Because the bumps are several microns in height, to achieve reasonable throughputs and minimal heat load on the substrate we utilize high deposition rates coupled with high capacity thermal evaporation sources (CH-5 & CH-6).
Water Cooled Chambers
Angstrom's chambers are regularly equipped with water cooling channels, effectively compensating for the high temperatures required for ideal indium solder bumps.
Automated Masking
Depending on feature size, flip chip bumps can be deposited through shadow masks.
Speak to a specialist about creating indium solder bump flip chips:
A few examples of our capabilities
Testimonials
From the time it was delivered, this laboratory system has performed nearly flawlessly, arguably extending our capabilities well beyond those currently attainable by any organic thin film laboratory in the world. I attribute the success of this entire system to the excellence of the engineering as well as the cooperative nature of the Angstrom team in taking our best designs and making them better during the system construction process.
Dr. Stephen Forrest - University of Michigan
The EvoVac design is terrific and the glovebox port is easy to work with. Last year, it was used 2269 hours, averaging over 6 hours a day every day of the year. It is the single most used piece of equipment at our facility, and essential to numerous research projects. As such, it is critical that downtime is minimized. The support Angstrom Engineering provides for service issues is exceptional, and unparalleled. My job would be significantly easier if I received the customer support Angstrom offers for the other instruments in our facility.
Dr. Ina Martin - Case Western University
