RF SPUTTERING
Radio Frequency
Sputter deposition of insulating materials cannot be done with DC power. Materials such as oxides, nitrides, and ceramics have very large DC impedance and require prohibitively high voltages to ignite and maintain a plasma. Luckily, the impedance of these materials changes with the frequency of the applied power.
Using power delivered at radio frequencies (RF) – typically at 13.56 MHz – and an automatic impedance matching network, the total impedance of the circuit can be regulated to 50 Ω which is suitable for plasma ignition in typical sputtering environments.
Insulating materials can also be deposited by reactive sputter deposition of metallic targets.
Configurations & Fixturing Options
This technology is available in various source configurations and is compatible with many Angstrom Engineering® process control capabilities and advanced fixturing options.
Process Control Software
Aeres® Angstrom Engineering's® advanced process control software has been specifically configured with features and capabilities unique to high-performance deposition.
Configurations & Fixturing Options
This technology is available in various source configurations and is compatible with many Angstrom Engineering® process control capabilities and advanced fixturing options.
Process Control Software
Aeres®, Angstrom Engineering's® advanced process control software, has been specifically configured with features and capabilities unique to high-performance deposition.
"Angstrom Engineering® is as close to an ‘easy button’ for deposition as one can get."
Tony Novembre
Associate Director of PRISM, Princeton University