Indium Deposition for Bump Bond Interconnects

High Aspect Ratio Indium Bumps

Creating high aspect ratio indium bumps requires a combination of high deposition rates and low substrate temperatures to balance the competing vertical and horizontal growth rates. Angstrom Engineering's platforms have been designed to provide fine control of both variables to provide complete flexibility of the types of bumps you'd like to create. Paired with our proven automation and high-throughput capabilities, Indium Series becomes a workhorse evaporator for bump bond fabrication that is both easy to use and simple to maintain.

Film Thickness

With the base Indium Series platform, you can create films up to 20 μm from a single point source, in a single vacuum cycle. The deposition platform can be configured to deposit films up to 100 μm.

High Indium Deposition Rates

Highly stable and controllable indium depositions at rates between 1 to 100 Å/sec makes for very accurate and repeatable thickness termination. Even at extreme deposition rates, you can maintain indium bumps with excellent sheer strength, small grain size, and good lift-off yield. Finely tuned columnation control is achieved by utilizing throw distance and source aperture control.

Source and Substrate Cooling

Due to Indium's low melting point, keeping the source and substrate fixturing cool is essential for growing textured indium films with small grain sizes and high shear strength. Indium Series utilizes a liquid cooled substrate stage with capability of fluid temperatures lower than -70° C, up to +150° C and includes a water-cooled shroud around the source to contain the deposition plume only to the substrate.

Superior Uniformity

Indium Series platforms include a motorized stage with adjustable source-to-substrate distances. For users that require highly controlled film thickness uniformity and lift-off geometry, users can adjust this distance to  > 680 mm. This will produce indium films with excellent thickness non-uniformity, and will minimize the edge-effect of the films.

Speak to a specialist about creating indium solder bump flip chips:


From the time it was delivered, this laboratory system has performed nearly flawlessly, arguably extending our capabilities well beyond those currently attainable by any organic thin film laboratory in the world. I attribute the success of this entire system to the excellence of the engineering as well as the cooperative nature of the Angstrom team in taking our best designs and making them better during the system construction process.

Dr. Stephen Forrest - University of Michigan

The EvoVac design is terrific and the glovebox port is easy to work with.  Last year, it was used 2269 hours, averaging over 6 hours a day every day of the year.  It is the single most used piece of equipment at our facility, and essential to numerous research projects.  As such, it is critical that downtime is minimized.  The support Angstrom Engineering provides for service issues is exceptional, and unparalleled.  My job would be significantly easier if I received the customer support Angstrom offers for the other instruments in our facility.

Dr. Ina Martin - Case Western University