Magnetron Sputtering
DC SPUTTERING
Direct Current Sputtering
Magnetron sputtering using DC power is an effective and economical choice for depositing conductive materials such as metals or transparent conductive oxides (TCOs). For magnetic materials such as Fe (iron), Ni (nickel), or Co (cobalt), DC magnetrons can be configured with magnets specifically selected for generating plasma within a strong magnetic field.
Deposition of non-conductive materials, however, requires a different power delivery system. Radio frequency (RF) power can be used for sputter deposition of insulating target materials, and pulsed DC power can be used for reactive sputter deposition of insulating materials from a conductive metal target.
Configurations & Fixturing
This technology is available in various source configurations and is compatible with many Angstrom Engineering® process control capabilities and advanced fixturing options.
Process Control Software
Aeres® Angstrom Engineering's® advanced process control software has been specifically configured with features and capabilities unique to high-performance deposition.
Configurations & Fixturing
This technology is available in various source configurations and is compatible with many Angstrom Engineering® process control capabilities and advanced fixturing options.
Process Control Software
Aeres®, Angstrom Engineering's® advanced process control software, has been specifically configured with features and capabilities unique to high-performance deposition.
Go with Angstrom! It’s an easy choice. They have quality equipment, they have good people, and they have really great follow-through; they won’t sell you a system and then forget about you. It’s a solid, good product and a great company to work with.
Dr.Trisha Andrew
University of Massachusetts Amherst