PLD
Our Pulsed Laser Deposition (PLD) systems are engineered to deliver unparalleled precision in thin-film fabrication for advanced material research.
Whether used as a standalone platform or seamlessly integrated into a cluster system, our PLD solutions offer a level of control needed for the development of next-generation materials.
Features & Capabilities
Standalone & Cluster Integration
Expandable for high-throughput pilot or commercial-scale manufacturing.
Stoichiometric Fidelity
Mimics target composition
Uniform Films & Fast Prototyping
Optimized growth conditions
Epitaxial Growth Capability
Enhances surface diffusion and impurity desorption
Real-Time Monitoring
RHEED for real-time analysis
Partnering with Angstrom Engineering®
Collaborate with our expert team for custom PLD solutions tailored to your material and process requirements. From design to optimization, we ensure precision, reliability, and innovation for your research goals. Standalone or cluster-integrated solutions available.
✔ High-Temperature Superconductors – Ideal for Josephson Junctions and quantum computing research
✔ Transparent Conductive Oxides – Deposit precise chemistries without complex reactive sputtering process
✔ Combinatorial PLD – Create solid solutions with compositional gradients for rapid property analysis
✔ High Entropy Materials – Deposit multi-element systems with chemical disorder for tunable properties
Advanced Process Control Software
- PC/PLC-controlled recipes for single, batch, or automated processes.
- Advanced data logging and process tracking ensure consistent and repeatable processes.
- The central control station manages each module and schedules the processes in each chamber.
- Independent control of multiple chambers (if applicable).
- Complex recipes can be created and modified easily.
- Automatic PID control loop tuning significantly reduces process development time.
Learn more about Aeres®.
Why Pulsed Laser Deposition?
Pulsed laser deposition (PLD) combines high-energy laser ablation with controlled vacuum environments, exceptional uniformity and adhesion across a wide range of substrates. It enables researchers to achieve exact chemical compositions while maintaining structural integrity.
PLD is accelerating innovation in fields such as quantum computing, electronics, and energy technologies.
How it Works
PLD uses ultra-short, high-energy laser pulses to ablate material from a solid target, generating a plasma plume that deposits onto a heated substrate within a controlled vacuum environment.
This process preserves complex stoichiometries and allows precise control over deposition pressure, ranging from ultra-high vacuum to several torr.
Why PLD?
PLD is the go-to technique for advanced research offering:
✔ High-quality, multi-element thin films
✔ Stoichiometric accuracy and strong adhesion
✔ Safe, efficient deposition without hazardous precursors
PLD can deposit complex compounds like YBCO (YBa₂Cu₃O₇₋ₓ) and other REBCO (Rare-earth barium copper oxide) superconductors directly from pure targets, achieving near-identical compositions with minimal post-processing.
PLD enables safe deposition of hexagonal boron nitride (h-BN), a material that is difficult to produce using CVD or sputtering, while simpler materials such as TiN and ITO can be grown without the need for reactive sputtering conditions.