A standard high vacuum deposition system requires the user to input a single wafer sample onto the substrate stage for every pump down and vent cycle, repeating the process if they wish to create a sample with a different thickness or film qualities for comparison. The problem is that once atmosphere is introduced to the deposition chamber and time elapses between runs, subtle changes in conditions can occur from run to run.

With the masking shutter stage enhancement, you can create many samples that are deposited with identical conditions in a single batch. With complete control over exposure of each row and column, along with the capability of the entire mechanism to clock the sample matrix, you can create samples with varied thicknesses and material architectures (depending on sources).

You can then properly identify the impact of subtle film differences with confidence, knowing every layer deposited was created in identical conditions.

Employing a masking shutter on your physical vapor deposition platform maximizes efficiency and productivity, as you can create so many samples in a single run. Beyond all this, the stage even allows for gradient and stepped films across a single, larger substrate.