Deposition Technology

Thin film deposition includes a number of technologies associated with growing layers of materials on a substrate with thicknesses that can range from less than 1 nm to several microns. Our vacuum equipment is tailored by a team of engineers to meet each client’s needs and is capable of incorporating any (or all) of the following:

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alt = vibrant image of a sputtering process. It displays inside a sputtering chamber with colors of green and purple from the targets. This highlights the detail of the sputtering process for deposition and Angstrom Engineering's dedication to manufacture these processes.

Sputter Deposition

The impact of high energy particles contained in a plasma eject atoms from the surface of a target material, which then condense on the surface of the substrate to create a thin film.

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alt = view of an electron beam apparatus. It is metal with rods, sensors, and connectors. It is polished and emphasizes a high-precision environment that Angstrom Engineering created.

Electron Beam Evaporation

A filament emits a magnetically focused, high energy beam that is swept within a crucible of deposition material.

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alt = close up of a resistive heating source. It has a small amount of gold material in the center, with dark colored conductive material. The metallic components surrounding it are precisely arranged which highlights the intricate work done by Angstrom Engineering.

Resistive Thermal Evaporation

Electrical current is used to heat a filament, which in turn heats deposition material to the point of evaporation.

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Optical Thin Film Control

Our optical control package can be integrated into our PVD platforms.

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alt = A glove box system labeled 'Inert' and 'PURE LAB' is a white rectangular enclosure with multiple black rubber glove ports for manipulation in the sealed chamber. The system includes a cylindrical attachment on the right and a digital monitor mounted above, providing detailed control and operational data. The design indicates an advanced setup for handling sensitive materials in a controlled environment.

Glovebox Integration

Allows PVD and non-PVD processes to be connected within a controlled environment.

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alt = close up of a Variable GLAD (Glancing Angle Deposition) stage in a deposition chamber. It has mechanical components such as cylindrical components showcasing the precise engineering done by Angstrom Engineering.

Variable Angle Stages

Deposit into the third dimension with this novel process enhancement.

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alt = Interior of a sputter ion deposition system. It is illuminated by blue light. It has visible circular ion targets as well as a rotating platform. It demonstrates the technical, precise components manufactured by Angstrom Engineering

Ion Assisted Deposition

A broad beam ion source directs a dispersed ion beam with a range of ion energies toward the substrate, typically along with a sputter or electron beam source.

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alt = close up of a Variable GLAD (Glancing Angle Deposition) stage in a deposition chamber. It has mechanical components such as cylindrical components showcasing the precise engineering done by Angstrom Engineering.

Process Enhancement Technologies

So many different enhancements are available for your deposition platform.