LOW PRESSURE CHEMICAL VAPOR DEPOSITION SYSTEM

Designed and manufactured to meet the high temperature and rapid cooling requirements of graphene and CNT research, Angstrom Engineering’s® LPCVD (Low Pressure Chemical Vapor Deposition) system will fit in nicely in your lab.

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Process Specific 

Process Specific

Quantum Series

Perovskite Series

Reticle Ion Beam Sputter

Linear Sputter

2D Coatings

Space/Environmental Simulation

Glove Box Integration

The tool you need to study & utilize graphene & carbon nanotubes. 

We engineered a water-cooled furnace that can reach 1100°C in 10 minutes and cool down below 800°C in a mere 2 minutes. Controlled graphene growth is ensured, and the Low-Pressure Chemical Vapor Deposition system keeps processing times to a minimum. Various chamber tube sizes are available between Ø 2 in and Ø 8 in, allowing the processing of single small samples up to batches in 6-inch wafers.

Process Specific Advantages

Reactor
  • Ø 50 mm-Ø 200 mm quartz tube chamber
  • Interchangeable Quartz tubes of various sizes as required
  • Accommodates Individual or multiple substrates up to 150 mm x 150 mm
  • Upstream end flange with quick connections to gas manifold
  • Downstream end flange with quick connections to pumping and gauging
Temperature/Pressure Control
  • The Low Pressure Chemical Vapor Deposition system features a single-zone quartz lamp furnace with a 6-inch uniform temperature zone
  • Auto-tuning feature provides very stable temperature control
  • Rapid heating to 1100°C in 10 minutes
  • Rapid cooling from 1100°C to 800°C in 2 minutes
  • Downstream pressure control 100mTorr to 500Torr using a throttling VAT butterfly valve
  • Up to 12 mass flow controllers
Operation & Safety
  • Safety circuit (hardware and software)
  • Flammable gas sensor (H2)
  • Enclosed frame and safety guarding
  • PC / PLC controller including Windows-based recipe and control software
  • Editable recipes, data logging, and password-protected access control

Advanced Process Control Software

  • PC/PLC-controlled recipes for single, batch, or automated processes.
  • Advanced data logging and process tracking ensure consistent and repeatable processes.
  • High-resolution control provides impressive low-rate stability and consistent doping ratios.
  • The central control station manages each module and schedules the processes in each chamber.
  • Independent control of multiple chambers (if applicable).
  • Complex recipes can be created and modified easily.
  • Automatic PID control loop tuning significantly reduces process development time.
alt = A screenshot of Angstrom Engineering's AERES software on a monitor. The software is showing a detailed dashboard with charts, graphs, and data for monitoring and controlling thin film deposition processes. The layout has side navigation with equipment status icons and a central graph with real-time data. The interface is designed for precise control and analysis in advanced engineering applications for Angstrom Engineering’s systems.

Learn more about Aeres®.

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Dr. Stephen Forrest
University of Michigan

From the time it was delivered, this laboratory system has performed nearly flawlessly, arguably extending our capabilities well beyond those currently attainable by any organic thin film laboratory in the world. I attribute the success of this entire system to the excellence of the engineering as well as the cooperative nature of the Angstrom team in taking our best designs and making them better during the system construction process.