RETICLE® iBSD

Our Reticle® ion beam sputter deposition systems are designed and engineered to create precise optical films of the highest purity, density, and stability. Angstrom Engineering’s Reticle® systems provide a turn-key solution for those looking to realize any optical design into a high-performance film.
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Process Specific 

Process Specific

Quantum Series

Perovskite Series

Reticle Ion Beam Sputter

Linear Sputter

2D Coatings

Space/Environmental Simulation

Glove Box Integration

When precision is paramount — RETICLE® delivers.

This is an ideal system for applications such as antireflective (AR) coatings, highly reflective (HR) coatings, coatings for laser diode bars, telecom optical filters, and vanadium oxide deposition.

Angstrom Engineering® designs and engineers each Reticle® platform to provide our partners in the optics community the ability to create the films they need with excellent purity, density, and uniformity, all in a highly repeatable and automated fashion.

alt = Angstrom Engineering Reticle 200 IBSD Ion Beam Sputter Deposition System, a high - tech design including a control panel, various dials and computer monitor with AERES software
Alt text: A scientist operates a system from the Reticle series for ion beam sputtering created by Angstrom Engineering. The advanced equipment features an open chamber with an intricate interface, emphasising the precision in optical coatings production.
alt = Angstrom Engineering load lock chamber used for ion beam sputter deposition in the Reticle Series. This chamber facilitates precise material layering and thin film deposition on substrates. It is critical for handling multiple samples and transferring them into the main processing chamber.

Reticle® employs Ion Beam Sputter Deposition (IBSD), in which a focused beam of highly energetic ions is accelerated toward a target comprising the material to be deposited. Thoughtful design of the ion beam focusing optics confines the beam entirely to the area of the target, eliminating any risk of contamination. 

  • The IBSD process creates a highly energetic flux of deposition material, leading to films with improved density, hardness, and surface roughness compared to those deposited by evaporation processes.
  • IBSD takes place in a high vacuum environment, minimizing noble gas inclusion in the deposited film and improving the environmental stability of the coating.
  • IBSD processes can also employ a secondary ion source for substrate cleaning and energetic assist, substrate heating for reactive deposition, and in-situ optical monitoring or ellipsometry for critical layer thickness termination. 

Process Specific Advantages

Film Quality

Deposition Ion Source

Reticle® employs a selection of gridded RF-ICP ion sources for high-energy deposition.

  • Available sources include 4, 10, 14, and 22 cm grid configurations with ion energies up to 1200 eV and beam currents greater than 1000 mA.
  • Self-aligned ion optics are configured specifically for the desired deposition requirements and geometry of your process.
  • A low-frequency neutralizer ensures stable beam operation without contamination from a traditional filament.
  • Operation of the RF-ICP source is handled by Aeres®, combining the power of full process flexibility with the ease of one-touch, automated recipe control.

Secondary Ion Source

  • All standard Reticle® platforms include an additional gridless end-Hall ion source with hollow cathode neutralizer.
  • The end-Hall source is optimized for substrate cleaning/etching, ion-assisted deposition, or reactive IBSD processes.
  • For processes that require deep substrate etching, a selection of gridded DC or RF-ICP ion sources is also available.

Target Carousel

  • The deposition ion source is directed toward a material target which has been optimized in both size and position for the required deposition geometry.
  • Targets are water-cooled for improved process stability and continuously rotate to prevent beam texturing. For multi-layer depositions, the carousel can be automatically indexed between targets, with up to 8 positions available.
  • Target rotation and carousel indexing each have torque sense, preventing any process problems due to slips or jams in rotation.

Vacuum Environment

  • Reticle® can be configured for both high and ultra-high vacuum environments.
  • High-speed, magnetically levitated turbomolecular pumps serve as the primary high vacuum pump.
  • An optional cryogenic pump improves base pressure and pumping speed and can be isolated from the chamber during reactive processes with oxygen.
  • Low-profile chamber bake-out heaters remove moisture from the chamber walls and shielding, improving base pressure and overall process stability.

Film Uniformity

Variable Angle Sweep

Along with sample rotation, the variable angle stage that is utilized for Reticle® provides for in-built angular motion through the deposition flux.

Sweeping the tilt angle can improve film thickness uniformity and sidewall coverage while also avoiding high energy-reflected neutral species for critical processes.

Each axis of motion is controlled through Aeres® using precision servo motors, providing better than 0.1 degrees of positional accuracy. Front side infrared heating bulbs tilt with the stage to provide a consistent temperature profile for reactive processes.

Planetary Motion

Planetary rotation integrates a third axis of motion to the variable angle stage.

The size, position, and gear ratio of each planet are optimized to provide the absolute best possible film thickness uniformity.

Uniformity Shaping

Dynamic uniformity shaping is achieved using a flux correction shield between the deposition source and the substrate.

The shape of each correction shield can be modelled and empirically optimized for any process.

Each correction shield can be tilted in situ to find the perfect balance between film uniformity and deposition rate.

Precise Thickness Control

Optical Monitoring

In-situ optical monitoring and control is available through Angstrom’s optical monitoring & control package.

Our unique design allows for direct or indirect monitoring of the variable angle stage, eliminating the need for tooling factors or a witness glass changer. Learn more about the Optical Monitoring & Control package here.

In-Situ Ellipsometry

In-situ ellipsometry provides critical information on the performance of an optical film while it is being deposited.

Layer termination from ellipsometric data is fully integrated into Aeres®. A variety of multi-wavelength and spectroscopic ellipsometry solutions are available with the ion beam sputter deposition system.

Quartz Crystal Microbalance (QCM)

A shuttered QCM located near the substrate provides feedback on the deposition rate and physical thickness of the growing film.

Commonly, a QCM is used to calibrate an initial deposition rate before completing the layer thickness under time control with a fixed beam current. Shuttering the crystal will drastically extend its operating lifetime during long processes or on systems with a load lock. 

Advanced Process Control Software

  • PC/PLC-controlled recipes for single, batch, or automated processes.
  • Advanced data logging and process tracking ensure consistent and repeatable processes.
  • High-resolution control provides impressive low-rate stability and consistent doping ratios.
  • The central control station manages each module and schedules the processes in each chamber.
  • Independent control of multiple chambers (if applicable).
  • Complex recipes can be created and modified easily.
  • Automatic PID control loop tuning significantly reduces process development time.
alt = A screenshot of Angstrom Engineering's AERES software on a monitor. The software is showing a detailed dashboard with charts, graphs, and data for monitoring and controlling thin film deposition processes. The layout has side navigation with equipment status icons and a central graph with real-time data. The interface is designed for precise control and analysis in advanced engineering applications for Angstrom Engineering’s systems.

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Dr. Steven Jim
University of California Irvine

Variable angle stages allow for very powerful thin film techniques. However, one of its biggest challenges is reproducibility. The substrate is often set at a very oblique angle in relation to the source, and the films are very sensitive to the precision of this angle. If it’s off by even half a degree, it will affect the morphology of these nanostructures considerably.

Angstrom went to great lengths to refine the tolerances of the tilt angle, improving it from a variation of up to a full degree on non-Angstrom systems I’ve used to less than 0.1 degree. Those wonderfully narrow tolerances allow us to repeatedly create very precise nanostructures. I can say wholeheartedly the product and service Angstrom Engineering® delivered has been amazing.